封裝與測試職缺

We are seeking a Senior Field Application Engineer to join one of the world’s fastest-growing semiconductor companies. Based in Shenghai, you will work closely with a global R&D team to deliver advanced analog power, signal chain, and embedded processor solutions across automotive, industrial, consumer electronics, and cloud computing applications. This role combines hands-on technical support with cross-functional collaboration. You will support product introduction, resolve customer technical issues, collect market feedback, and contribute to product optimization and new product development. You will also deliver technical training and support the sales team with technical presentations and customer engagement.

About the Role We are looking for an experienced Principal Packaging Engineer to lead advanced semiconductor packaging development for high-performance IC products. This role involves cross-functional collaboration, technical leadership, and hands-on problem solving in package design, assembly process optimization, and technology development. You will work closely with silicon, packaging, systems, and IC design teams to deliver reliable, manufacturable, and cost-effective package solutions for next-generation devices. This position suits engineers who enjoy both technical depth and teamwork in a supportive environment.