Package Design Engineer 先進封裝設計

Join a leading global semiconductor company as a Packaging Design Engineer. You will drive package development from concept to production, collaborate with customers and cross-functional teams, and support advanced package design, technical problem solving, and new technology development.

Packaging Design Engineer

Salary: Competitive and based on experience

Location: Hsinchu

Keywords: collaborative, co-operat, dependable, supportive leadership, inclusive, knowledgeable, training opportunities, flexible working opportunities, enthusias-

A leading organisation in Hsinchu is seeking a Packaging Design Engineer to join their expert team. This role offers you the opportunity to work closely with customers and internal specialists, ensuring that packaging solutions are not only competitive but also cost-effective and technically robust. You will be at the forefront of new technology development, collaborating with signal integrity engineers, substrate designers, and thermal designers to deliver innovative results. The company values inclusivity, knowledge-sharing, and provides flexible working opportunities alongside ongoing training to help you grow your skills. If you are passionate about packaging design and eager to contribute to a supportive environment where your expertise is valued, this is the perfect opportunity for you.

• Work directly with customers and cross-functional teams to define and deliver competitive packaging solutions that meet technical and commercial requirements.
• Be part of a knowledgeable group that encourages sharing ideas and supports professional growth through training opportunities and flexible working arrangements.
• Contribute to the development of new package technologies and design flows while enjoying a collaborative workplace culture focused on teamwork and mutual support.

What you'll do:

As a Packaging Design Engineer based in Hsinchu, you will play a pivotal role in shaping advanced packaging solutions for clients. Your day-to-day responsibilities will involve close collaboration with customers to identify their unique requirements, followed by designing packages that address technical challenges while maintaining cost-effectiveness. You will work hand-in-hand with signal integrity engineers, substrate designers, and thermal designers to ensure every solution meets rigorous standards. Leveraging your familiarity with industry-leading tools like Cadence Allegro Package Designer (APD) and AutoCAD, you will execute detailed designs across various packaging architectures including FCCSP, FCBGA, CoWoS, and 2.5D. Your involvement in developing new technologies and design flows will keep you at the cutting edge of the field. Success in this role requires strong interpersonal skills for effective communication across teams, a commitment to continuous learning through training opportunities provided by the company, and a passion for contributing within an inclusive environment where knowledge-sharing is encouraged.

• Collaborate with customers to understand their needs and define packaging solutions that are both competitive in the market and technically sound.
• Design packages by solving technical challenges, managing all related actions, and ensuring follow-up throughout the project lifecycle.
• Work closely with signal integrity engineers, substrate designers, and thermal designers to create cost-effective packages that meet performance standards.
• Develop new package technologies and design flows, staying ahead of industry trends and integrating best practices into daily work.
• Coordinate with various stakeholders to ensure seamless communication and co-operation across different disciplines involved in packaging design.
• Apply your expertise in packaging architectures such as FCCSP, FCBGA, CoWoS, and 2.5D packaging to deliver high-quality results.
• Utilise Cadence Allegro Package Designer (APD) and AutoCAD for precise package design tasks, ensuring accuracy and efficiency.
• Engage in IC-PKG-PCB Co-design flow activities, contributing your knowledge of package and substrate types to optimise designs.
• Implement SI/PI Co-simulation concepts and workflows for various IPs, enhancing overall package performance.
• Support continuous improvement initiatives by sharing insights, participating in training sessions, and fostering an inclusive team environment.

What you bring:

The ideal Packaging Design Engineer brings proven experience from at least three years working within semiconductor or electronics industries. Your technical proficiency spans key software tools such as Cadence Allegro Package Designer (APD) and AutoCAD which are essential for executing intricate designs. You have deep familiarity with multiple packaging architectures including FCCSP, FCBGA, CoWoS, and 2.5D—enabling you to adapt quickly to varied project demands. Your understanding of package types, substrates, IC-PKG-PCB co-design flows as well as SI/PI co-simulation concepts ensures you can contribute meaningfully across all stages of product development. Beyond technical skills, your ability to communicate fluently in English supports effective collaboration within international teams. You thrive in environments where dependability is valued; consistently following up on actions ensures successful outcomes. Your collaborative approach helps build strong relationships across departments while your enthusiasm for ongoing learning keeps you engaged with new developments in the field. By embracing inclusivity through knowledge-sharing initiatives you help foster a positive team culture where everyone’s expertise is respected.

• You have at least three years of relevant industry experience in packaging design engineering roles within semiconductor or electronics sectors.
• You are highly familiar with Cadence Allegro Package Designer (APD) as well as AutoCAD for executing complex package designs efficiently.
• Your expertise covers multiple packaging architectures such as FCCSP, FCBGA, CoWoS, and 2.5D packaging which enables you to tackle diverse project requirements.
• You possess extensive knowledge of different package types and substrates along with proficiency in IC-PKG-PCB Co-design flow processes.
• You are comfortable applying SI/PI Co-simulation concepts and workflows for various IPs to enhance package performance.
• Your English language skills are proficient across listening, speaking, reading, and writing which allows you to communicate effectively within global teams.
• You demonstrate dependability through consistent follow-up on all package-related actions ensuring projects stay on track.
• You bring a collaborative spirit that fosters co-operation among cross-functional teams including signal integrity engineers and substrate designers.
• You show enthusiasm for continuous learning by engaging in training opportunities offered by the company.
• You value inclusivity by supporting knowledge-sharing initiatives within the team environment.

What sets this company apart:

This organisation stands out for its commitment to creating an inclusive workplace where every team member’s contributions are valued. Employees benefit from flexible working opportunities that allow them to balance personal commitments while advancing their careers. The company invests heavily in training programmes designed to nurture talent at all levels—ensuring you have access to resources needed for professional growth. Knowledge-sharing is actively encouraged so you can learn from experienced colleagues while also sharing your own insights. Supportive leadership ensures guidance is always available when needed; fostering an environment where collaboration thrives over competition. The focus on teamwork means achievements are celebrated collectively rather than individually—making it an ideal place for those who appreciate communal success. With a reputation for delivering high-quality solutions through dependable service this organisation offers stability alongside exciting prospects for advancement within the packaging design engineering field.

What's next:

If you feel ready to take your career forward as a Packaging Design Engineer in Hsinchu’s thriving technology sector—this is your chance!

Apply today by clicking on the link provided; don’t miss out on joining a supportive team dedicated to excellence.