Advanced packaging technology development engineer/ manager

Advanced Packaging Technology Development Engineer or Manager

Salary: Competitive and based on experience

Location: Hsinchu

Keywords: collaborative, supportive leadership, inclusive, knowledgeable, dependable, flexible working opportunities, training opportunities, growth leadership, generous pensions contributions

A leading organisation in the semiconductor industry is seeking an Advanced Packaging Technology Development Engineer or Manager to join their team in Hsinchu. This role offers you the opportunity to work at the forefront of process technology development, focusing on advanced chiplet and 3DIC packaging innovations. You will be part of a knowledgeable and supportive network, where your expertise will contribute directly to new product introduction, yield improvement, and advanced packaging structure design. The company values inclusive collaboration, flexible working opportunities, and ongoing training to ensure you continue to grow both professionally and personally. If you are passionate about advanced packaging technologies and eager to make a meaningful impact within a dependable team, this position provides an exciting platform for your skills and experience.

• Work with a highly experienced team dedicated to advanced process technology development, offering you the chance to collaborate on cutting-edge projects that shape the future of semiconductor manufacturing.
• Enjoy flexible working opportunities and generous pension contributions, ensuring your wellbeing and professional growth are supported as you advance your career in a nurturing environment.
• Benefit from continuous training opportunities and supportive leadership that encourages knowledge sharing, personal development, and inclusive teamwork across all levels of the organisation.

What you'll do:

As an Advanced Packaging Technology Development Engineer or Manager, you will play a pivotal role in shaping the future of semiconductor packaging by driving new product introduction technology development. Your day-to-day responsibilities will involve planning trial productions, conducting detailed inspections, designing advanced structures at both wafer and panel levels, and collaborating with various teams to integrate chiplet and 3DIC technologies. You will also lead simulation analyses for mechanical and thermal properties while supporting large-scale packaging projects. Success in this role requires a deep understanding of process optimisation, reliability enhancement, optical packaging techniques, PI/SI analysis, and mentoring others within a supportive network. Your contributions will directly impact yield improvement strategies and mass production outcomes, making this position ideal for someone who thrives in an inclusive environment where knowledge sharing is valued.

• Plan and execute advanced new product introduction technology development initiatives, including trial production planning, DRC inspection, DOE strategies, and yield improvement activities.
• Conduct mass production interval analysis and yield assessments to optimise processes for high-volume manufacturing.
• Design advanced packaging structures at both wafer level and panel level, applying your expertise to create innovative solutions for next-generation products.
• Collaborate closely with cross-functional teams to ensure seamless integration of chiplet and 3DIC packaging technologies into existing workflows.
• Lead simulation analyses of mechanical properties and thermal properties to enhance reliability and performance of packaging solutions.
• Drive development efforts in large-scale packaging and memory technologies, contributing your insights to improve product quality and efficiency.
• Apply common optical packaging technology techniques to support diverse product requirements across multiple applications.
• Perform PI/SI application analysis to ensure signal integrity and power integrity throughout the packaging process.
• Provide practical guidance on layout, process optimisation, and reliability improvements based on extensive hands-on experience.
• Mentor junior engineers and share knowledge within the team, fostering a collaborative environment focused on continuous improvement.

What you bring:

To excel as an Advanced Packaging Technology Development Engineer or Manager, you bring more than eight years of proven experience in advanced packaging environments such as foundries. Your academic background includes a Master’s degree in engineering or a related discipline. You possess practical skills in layout optimisation, process reliability enhancement, simulation analysis for mechanical and thermal properties, as well as large-scale packaging development including memory technologies. Your familiarity with optical packaging techniques allows you to tackle varied technical requirements efficiently. Additionally, your expertise in PI/SI application analysis ensures signal integrity across complex systems. Beyond technical abilities, your strong interpersonal skills enable you to connect with colleagues across departments; your commitment to ongoing learning aligns with the company’s focus on training opportunities; and your inclusive approach contributes positively to the communal spirit of the organisation. These qualities make you an ideal candidate for this role.

• Mandatory: More than 8 years of practical experience in foundry or related advanced packaging environments is required for this role.
• Mandatory: A Master’s degree in engineering or a related field ensures you have the academic foundation necessary for success.
• Mandatory: Hands-on experience with layout/process/reliability practices demonstrates your ability to deliver robust solutions.
• Mandatory: Proven expertise in simulation analysis of mechanical properties and thermal properties supports effective problem-solving.
• Mandatory: Experience in large-scale packaging development as well as memory technology is essential for meeting project demands.
• Mandatory: Familiarity with common optical packaging technology enables you to address diverse technical challenges.
• Mandatory: PI/SI application analysis experience is crucial for maintaining signal integrity throughout complex processes.
• Nice to Have: Strong interpersonal skills allow you to collaborate effectively within cross-functional teams.
• Nice to Have: A commitment to ongoing learning through training opportunities reflects your dedication to professional growth.
• Nice to Have: An inclusive mindset helps foster positive relationships within a diverse workplace.