Semiconductor－Package/Test Jobs

Robert Walters has built a strong reputation across Taiwan for placing professionals into semiconductor industry. View our latest Package/Test jobs here.

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Test Hardware Engineer – Load Board and Multi-site Expansion

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Salary: Negotiable

Location: Taoyuan

Date Posted: 8 October 2026

Join a leading precision timing company as a Test Hardware Engineer in Taoyuan, driving advancements in semiconductor technology. Collaborate globally to optimize production performance, improve yield, and enhance operational excellence across manufacturing sites. Enjoy flexible working, ongoing training, and a supportive environment committed to innovation and employee growth. Be part of an inclusive team shaping industry-changing solutions with dependable leadership and shared success.

Memory Packaging Technical Manager

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Salary: Negotiable

Location: Hsinchu City

Date Posted: 23 September 2026

Keywords: collaborative, dependable, supportive leadership, inclusive, knowledgeable, flexible working opportunities, training opportunities, generous pensions contributions

Advanced packaging technology development engineer/ manager

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Salary: Negotiable

Location: Hsinchu City

Date Posted: 23 September 2026

Advanced Packaging Technology Development Engineer or Manager Salary: Competitive and based on experience Location: Hsinchu Keywords: collaborative, supportive leadership, inclusive, knowledgeable, dependable, flexible working opportunities, training opportunities, growth leadership, generous pensions contributions

3DIC Advance Package Design Engineer

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Salary: Negotiable

Location: Hsinchu City

Date Posted: 23 September 2026

3DIC Advanced Packaging Design Engineer Salary: Competitive and based on experience Location: Hsinchu Keywords: collaborative, supportive leadership, knowledgeable, dependable, inclusive, flexible working opportunities, training opportunities, generous pensions contributions

[MNC] Senior BI Developer & Tech Lead

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Salary: TWD1,200,000 - TWD2,500,000 per annum

Location: Hsinchu City

Date Posted: 23 August 2026

On behalf of our client—a leading global high-technology and semiconductor test solution provider—we are seeking an experienced Senior Business Intelligence Developer & Technical Solution Lead to join their regional analytics team in Taiwan.

Senior Test Engineer

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Salary: Negotiable

Location: Hsinchu City

Date Posted: 20 August 2026

About the Role We are seeking an experienced Sr. Test Engineer to lead our engineering efforts in test platform development and verification. The ideal candidate will have a strong background in test engineering, hands-on experience with logic IC product testing, and leadership abilities to manage cross-departmental projects and schedules. You will be responsible for driving test platform advancements and ensuring production quality through effective test program and fixture development.

Packaging Senior Manager / Director半導體封裝材料主管

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Salary: Negotiable

Location: Taoyuan

Date Posted: 20 August 2026

擔任半導體封裝材料事業單位副總經理／協理，將負責新事業與市場開拓，運用產業人脈及對封裝材料認證流程的理解，串聯研發、業務與客戶需求。具備團隊管理、P&L、新事業從 0 到 1 經驗，以及工業膠帶、底填膠等封裝材料背景者尤佳；適合來自材料供應商或 OSAT／封裝廠的資深主管。