Staff Package Design Engineer

Global US IC Design Company is hiring an experienced Package Design Engineer to drive package development for next-generation semiconductor products. This role involves end-to-end package design, close collaboration with R&D, manufacturing, and external partners, while ensuring product performance, manufacturability, and reliability. I

Staff New Product Introduction Package Design Engineer

Salary: Competitive and based on experience

Location: Hsinchu

Keywords: collaborative, supportive leadership, inclusive, training opportunities, knowledgeable, dependable, flexible working opportunities, growth leadership, generous pensions contributions

This is an exceptional opportunity for you to join a highly collaborative team as a Staff New Product Introduction Package Design Engineer in Hsinchu. The organisation is renowned for its commitment to technical excellence and offers a supportive environment where your expertise will be valued and nurtured. You will play a pivotal role in developing advanced packaging solutions for high-performance products, including amplifiers, codecs, and DSPs, utilising both traditional and cutting-edge technologies such as wire-bond QFN, WLCSP, and flip-chip designs. The company fosters a culture of continuous improvement, knowledge sharing, and professional growth, providing access to extensive training resources and a high-quality library. Flexible working opportunities are available to help you balance your personal and professional life, while generous pension contributions ensure your long-term security. If you are passionate about package design engineering and eager to make a meaningful impact within an inclusive and knowledgeable team, this role offers the perfect platform for your skills to flourish.

• You will have the chance to work on innovative packaging solutions for high-performance electronic products, collaborating closely with cross-functional teams to deliver reliable and manufacturable designs.
• The organisation provides flexible working opportunities, generous pension contributions, and access to extensive training resources to support your ongoing professional development.
• You will be part of a supportive leadership structure that values knowledge sharing, inclusivity, and growth leadership, ensuring you feel connected and empowered throughout your career journey.

What you'll do:

As a Staff New Product Introduction Package Design Engineer based in Hsinchu, you will immerse yourself in the development of advanced packaging solutions for high-performance electronics. Your day-to-day activities will involve close collaboration with cross-functional teams—including designers, layout engineers, customers, and manufacturing partners—to ensure every aspect of the package design meets stringent performance standards. You will leverage industry-leading tools like AutoCAD and Cadence SiP Layout to execute intricate physical designs while conducting thorough electrical simulations. Continuous improvement is central to this role; you will refine interfaces between packages, dies, and PCBs through process enhancements. Automation will be promoted throughout the workflow to streamline operations. You will also create test vehicles that evaluate critical factors affecting chip performance. Success in this position requires not only technical proficiency but also strong interpersonal skills as you work collaboratively with diverse stakeholders to resolve design challenges. Your ability to communicate effectively with both customers and management will be key in driving projects forward within this supportive environment.

• Collaborate extensively with internal teams and external customers to develop package designs that meet performance, reliability, and manufacturability requirements across multiple product lines.
• Define comprehensive package requirements from electrical, thermal, and mechanical perspectives by working closely with design and layout teams.
• Utilise industry-standard tools such as AutoCAD, GDS tools, Siemens Fast3D, and Cadence SiP Layout to execute physical design tasks, perform electrical simulations, and validate manufacturing solutions for package design.
• Refine die bump array/BGA integration using detailed die information to optimise interface accuracy between the package, die, and PCB.
• Drive continuous improvement initiatives aimed at enhancing the precision of package-to-die and package-to-PCB interfaces through process optimisation.
• Establish and maintain robust design rules for WLCSP, wire bond, and other packaging types by collaborating with customers, designers, and OSATs.
• Apply DFM checking techniques and implement modifications to improve assembly yield while proactively preventing manufacturing issues.
• Promote automation processes throughout the package design flow to increase efficiency and reduce manual intervention.
• Develop test vehicles that accurately assess bump placement, PCB proximity effects, WLCSP RDL stack up, and their impact on final chip performance.
• Work closely with customers to resolve complex design issues between piece parts and PCBs through effective communication and problem-solving.

What you bring:

To excel as a Staff New Product Introduction Package Design Engineer in Hsinchu, you should bring substantial experience from the packaging engineering sector—ideally spanning over five years—with deep familiarity in substrate design principles. Your academic background should include at least a bachelor’s degree in engineering disciplines related to mechanical, electrical, chemical or materials science. Technical proficiency is paramount; you must be adept at using Cadence SiP Layout tools alongside AutoCAD for sophisticated physical designs. A solid grasp of packaging technologies—from material properties through assembly rules—is expected. Your ability to interpret electrical simulation results on package designs will underpin your effectiveness in this role. Adaptability is demonstrated by your openness toward learning new software platforms such as Cadence Virtuoso on Unix workstations. Communication skills are crucial; you need to articulate complex technical concepts clearly when engaging both customers and management. Ownership of project outcomes paired with accountability ensures progress within collaborative frameworks. Building influential relationships across diverse teams highlights your interpersonal strengths. Additional skills such as familiarity with PCB/Die mechanical layout tools (Siemens Xpedition or Allegro PCB) further enhance your profile. Intellectual curiosity—supported by broad reading habits—and eagerness for self-learning or training opportunities round out the ideal candidate’s attributes.

• A Bachelor’s degree or higher in Mechanical Engineering, Electrical Engineering, Chemical Engineering or Materials Engineering is required for this role.
• You bring 5 to 8+ years of experience in a packaging-related field with proven expertise in package substrate design and assembly rules.
• Proficiency as a Cadence SiP layout user is essential along with strong skills in AutoCAD for executing complex physical designs.
• Your knowledge encompasses packaging technologies including materials selection as well as understanding electrical simulation results on package designs.
• Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations demonstrates your adaptability within technical environments.
• Excellent written and verbal communication skills enable you to review technical ideas effectively with both customers and senior management.
• You possess a dependable sense of ownership coupled with accountability for driving projects through completion within collaborative settings.
• Ability to build influential relationships in an inclusive environment is vital for success in this role.
• Conversant with PCB and Die mechanical layout tools such as Siemens Xpedition or Allegro PCB is highly desirable.
• Broad reading habits in areas relevant to packaging technology combined with curiosity about new technical concepts are considered advantageous.

What sets this company apart:

The organisation stands out due to its unwavering commitment to fostering an inclusive workplace where knowledge sharing is actively encouraged among all team members. Employees benefit from flexible working arrangements designed to accommodate individual needs while supporting work-life balance. Generous pension contributions provide financial security for the future. Access to extensive training resources—including a high-quality library—ensures continuous professional development so you can stay at the forefront of technological advancements within the industry. Supportive leadership structures promote growth leadership principles that empower employees at every level. The company’s dedication to nurturing talent within a collaborative environment makes it an ideal place for those who value teamwork, dependability, inclusivity, and ongoing learning opportunities.

What's next:

If you are ready to take your career in package design engineering to new heights within an inclusive team environment that values your expertise—apply now!

Apply today by clicking on the link provided.