To excel in this role, you bring HPC/AI semiconductor testing experience, burn-in knowledge, test automation skills, PCIe/HBM familiarity, data analysis ability, and Mandarin/English fluency.
- Education: Bachelor’s/Master’s in Electrical, Computer, or Mechanical Engineering (electronics focus)
- Experience: 3–5 years in semiconductor test (ATE, burn-in, SLT, reliability, thermal/mechanical)
- Thermal Expertise: Hands-on with liquid cooling, heat sinks, TIMs, and PID control systems
- Technical Skills: Proficient in programming (e.g., C/C++/C#, Java) and test automation tools
- Interface & Data: Knowledge of PCIe Gen5/6, HBM3, JTAG, STDF/CSV analysis, and reporting
- Communication & Mobility: Fluent in Mandarin and English with strong data interpretation and 50–60% travel readiness
- Soft Skills: Strong problem-solving, cross-functional collaboration, customer communication, and resilience under pressure
About the company:
A global engineering organisation operates in advanced electronics manufacturing, delivering high-performance testing solutions that support next-generation computing and intelligent hardware systems. It fosters a collaborative, innovation-driven environment with strong investment in employee growth, customer impact, and future-facing technologies.
Keywords: field application engineering, HPC/AI semiconductor testing, sales strategy, automated test scripts, engineering, manufacturing firm
What's next:
Join a cutting-edge engineering team shaping the future of AI and high-performance semiconductor innovation.
