Metallization & Advanced Packaging Expert

Keywords: collaborate, supportive leadership, knowledgeable, dependable, inclusive, flexible working opportunities, training opportunities, growth leadership, network, Team

Advanced Packaging and Metallization Specialist

Salary: Competitive and based on experience

Location: hsinchu

A leading global organisation is seeking an Advanced Packaging and Metallization Specialist to join their Glass Core development team in Hsinchu. This is a unique opportunity for you to play a pivotal role in shaping the future of semiconductor technology platforms that power AI, high-performance computing, and advanced electronics. You will be part of a knowledgeable and supportive network, collaborating with industry leaders and partners across the semiconductor ecosystem. The organisation offers flexible working opportunities, generous training programmes, and a culture that values inclusive growth leadership. If you are passionate about pioneering glass-based solutions and eager to contribute your expertise to next-generation packaging architectures, this role provides the perfect platform for your professional development.

• You will have the chance to influence technology strategy and guide development projects for cutting-edge glass substrate technologies used in AI, high-performance computing, networking, and advanced semiconductor applications.
• The organisation fosters a collaborative environment where you can engage with customers, foundries, OSATs, substrate manufacturers, and equipment suppliers to define requirements and accelerate technology adoption.
• Enjoy flexible working arrangements, access to ongoing training opportunities, and the support of a global cross-functional Team dedicated to innovation and knowledge sharing.

What you'll do:

As an Advanced Packaging and Metallization Specialist based in Hsinchu, you will immerse yourself in the forefront of glass-based solutions for next-generation semiconductor packaging. Your day-to-day responsibilities will involve leading technical development projects focused on Glass Core technologies while collaborating with global cross-functional teams. You will shape technology roadmaps for innovative package architectures such as 2.5D/3D integration and chiplet platforms. By engaging directly with customers and partners across the semiconductor ecosystem—including foundries, OSATs, substrate manufacturers, and equipment suppliers—you will help define requirements that accelerate technology adoption. Your expertise in substrate interconnects (including TGVs), redistribution layers (RDL), electroplating processes, thin-film deposition techniques, and advanced conductor technologies will be crucial in identifying technology gaps and supporting commercialisation strategies. You will also contribute to intellectual property development through patents and publications while championing communal efforts towards continuous improvement within the Team. Success in this role requires a commitment to collaboration, knowledge sharing, innovation-driven problem solving, and effective communication with both internal stakeholders and external partners.

• Lead the technical development of advanced packaging and metallization solutions for Glass Core technologies by providing expert guidance throughout all stages of research and commercialisation.
• Contribute actively to the creation and evolution of the glass core technology roadmap that enables next-generation package architectures such as 2.5D, 3D, chiplet integration, and heterogeneous platforms.
• Provide deep expertise in substrate interconnects including through-glass vias (TGVs), redistribution layers (RDL), electroplating processes, thin-film deposition techniques, and advanced conductor technologies.
• Engage directly with customers, foundries, OSATs, substrate manufacturers, and equipment suppliers to collaboratively define technical requirements and drive rapid adoption of new technologies.
• Identify critical technology gaps within current processes and products while driving innovation initiatives that support successful commercialisation strategies.
• Contribute meaningfully to intellectual property development by authoring patents, technical publications, and participating in industry engagement activities.
• Collaborate closely with global cross-functional teams spanning materials science, process development engineering, manufacturing operations, and business development functions.
• Guide multidisciplinary project teams by sharing your knowledge on package assembly reliability, thermal management solutions, electrical performance optimisation, and advanced packaging architectures.
• Support customer-facing activities by delivering clear communication on technical progress and aligning project goals with client needs across the semiconductor value chain.
• Champion communal efforts towards continuous improvement by nurturing a culture of knowledge sharing within the Team.

What you bring:

To excel as an Advanced Packaging and Metallization Specialist in Hsinchu you will bring extensive experience from the semiconductor industry—ideally over ten years—with deep familiarity in packaging processes such as substrate technology development or metallization techniques like sputtering or electroplating. Your academic background should include an M.S. or Ph.D. degree in relevant fields such as Electrical Engineering or Materials Science. You will demonstrate collaborative leadership skills by guiding multidisciplinary Teams through complex technical initiatives while maintaining excellent communication abilities for customer-facing interactions. Experience with glass substrates—including TGV technologies—and chiplet integration platforms will set you apart from other candidates. Established relationships within the semiconductor packaging ecosystem are highly valued along with a strong record of patents granted or technical publications authored. Your proven track record in successful technology commercialisation coupled with your commitment to communal knowledge sharing ensures you thrive within this supportive network.

• M.S. or Ph.D. degree in Electrical Engineering, Physics, Materials Science, Chemical Engineering or a related field is required for this position.
• At least ten years of experience in semiconductor packaging processes including substrate technology development or metallization techniques is essential.
• Deep expertise in metallization processes such as sputtering methods, electroplating procedures, seed-layer deposition practices, and surface finishing technologies is highly valued.
• A strong understanding of advanced packaging architectures including package assembly reliability considerations as well as thermal management solutions is necessary.
• Demonstrated ability to guide complex technical initiatives while influencing multidisciplinary Teams through collaborative leadership is expected.
• Excellent communication skills combined with proven customer-facing abilities are vital for success when engaging with clients across the semiconductor value chain.
• Fifteen or more years of industry experience is preferred for candidates seeking senior-level impact within this role.
• Experience working specifically with glass substrates including TGV technologies or chiplet integration platforms is considered advantageous.
• Established relationships within the broader semiconductor packaging ecosystem—spanning customers to equipment suppliers—will further enhance your candidacy.
• A strong record of patents granted or technical publications authored alongside successful technology commercialisation achievements is desirable.

What sets this company apart:

This organisation stands out as a global leader committed to pioneering advancements in glass-based solutions for next-generation semiconductor packaging. Their dedication to enabling AI-driven platforms for high-performance computing places them at the forefront of technological innovation within the industry. Employees benefit from flexible working opportunities designed to promote work-life balance alongside generous training programmes that foster continuous professional growth. The company’s culture emphasises inclusivity—welcoming under-represented talent—and encourages communal efforts towards shared success through supportive leadership practices. Collaboration across global cross-functional Teams ensures every member has access to knowledgeable colleagues who share insights freely while nurturing individual contributions within a dependable network. By joining this organisation you become part of an environment where your expertise is valued; your ideas help shape future technology platforms; and your career flourishes amidst ongoing learning opportunities—all without compromising personal wellbeing or professional integrity.