Memory Packaging Technical Manager

Keywords: collaborative, dependable, supportive leadership, inclusive, knowledgeable, flexible working opportunities, training opportunities, generous pensions contributions

Memory Packaging Technical Manager

Salary: Competitive and based on experience

Location: Hsinchu

A leading organisation in the manufacturing and quality sector is seeking a Memory Packaging Technical Manager to join their team in Hsinchu. This role offers you the opportunity to work at the forefront of advanced memory packaging technologies, including 2.5D, 3D, and 3.5D heterogeneous package development, LPDDR/HBM/IPM development, and customised HBM solutions. You will be instrumental in shaping the product memory roadmap and package memory architecture for next-generation products. The company is committed to fostering an inclusive and supportive environment where your expertise will be valued and your professional growth encouraged through flexible working opportunities, generous pension contributions, and ongoing training. If you are passionate about advanced packaging technology and eager to make a significant impact within a knowledgeable team, this is the perfect opportunity for you.

• You will have the chance to lead cutting-edge projects in advanced memory packaging, contributing directly to the development of new product introductions and innovative architectures.
• The organisation provides a supportive leadership structure that encourages collaboration, knowledge sharing, and personal development through flexible working arrangements and comprehensive training programmes.
• Your experience will be recognised within an inclusive workplace that values dependability, teamwork, and offers generous pension contributions as part of its commitment to employee wellbeing.

What you'll do:

As a Memory Packaging Technical Manager based in Hsinchu, you will play a pivotal role in advancing the organisation’s capabilities in memory package development. Your day-to-day responsibilities involve overseeing complex projects from concept through mass production, utilising your extensive experience in DRAM technologies such as LPDDR/HBM. You’ll collaborate with diverse teams to develop innovative solutions for heterogeneous package architectures while ensuring rigorous standards are met during new product introduction phases. Your expertise in simulation analysis—both mechanical and thermal—will be crucial for maintaining reliability across all designs. By guiding layout optimisation processes and supporting optical packaging advancements, you’ll help drive continuous improvement within the team. Success in this role requires not only technical proficiency but also a commitment to nurturing a collaborative atmosphere where knowledge is shared freely among colleagues.

• You will oversee the development of 2.5D, 3D, and 3.5D heterogeneous memory packages, ensuring that all technical aspects are managed with precision and care.
• You will drive LPDDR/HBM/IPM development for advanced packaging solutions, collaborating closely with cross-functional teams to deliver high-quality results.
• You will shape the product memory roadmap by providing expert guidance on package memory architecture and customising HBM development according to project requirements.
• You will plan new product trial production processes, including DRC inspection, DOE planning, yield improvement strategies, mass production intervals, and yield analysis.
• You will lead advanced chiplet and 3DIC packaging technology initiatives, applying your deep understanding of wafer-level and panel-level design structures.
• You will manage simulation analyses of mechanical properties and thermal properties to ensure reliability and performance across all packaging projects.
• You will contribute practical experience in layout, process optimisation, and reliability testing for large-scale packaging and memory development.
• You will support the development of common optical packaging technologies by leveraging your hands-on expertise in PI/SI application analysis.
• You will coordinate with foundry partners or related advanced packaging teams to facilitate seamless project execution and continuous improvement.
• You will mentor junior engineers and foster a collaborative environment that promotes knowledge sharing and professional growth.

What you bring:

To excel as a Memory Packaging Technical Manager in Hsinchu, you bring a wealth of proven experience spanning over ten years within DRAM technology domains such as LPDDR/HBM. Your deep understanding of memory design—from architectural concepts through process flows—enables you to navigate complex challenges associated with advanced package development. You possess practical skills in layout optimisation coupled with reliability testing that underpin successful large-scale projects. Your proficiency extends into simulation analysis where both mechanical integrity and thermal stability are paramount considerations for every solution delivered. Having worked extensively within foundry environments or similar advanced packaging sectors gives you unique insights into industry best practices. Additionally, your strong interpersonal abilities allow you to foster collaboration among team members while providing mentorship that supports ongoing professional growth. A master’s degree further demonstrates your commitment to excellence within manufacturing or quality fields.

• More than ten years of technical experience in DRAM (LPDDR/HBM) with research and development exposure considered highly valuable.
• Comprehensive familiarity with memory design principles, architectural frameworks, process flows, packaging methodologies, and material selection for advanced applications.
• Proven track record managing complex projects involving multiple stakeholders within manufacturing or quality environments.
• Practical hands-on experience in layout optimisation, process engineering, and reliability assessment for large-scale packaging initiatives.
• Expertise conducting simulation analyses of mechanical properties as well as thermal characteristics to ensure robust performance under varying conditions.
• Demonstrated ability developing advanced chiplet technologies alongside wafer-level and panel-level packaging structures.
• Experience supporting common optical packaging technology developments through PI/SI application analysis techniques.
• Extensive background working within foundry operations or related advanced packaging sectors for more than eight years.
• Strong interpersonal skills enabling effective collaboration across multidisciplinary teams while mentoring junior staff members.
• Master’s degree or higher qualification relevant to manufacturing or quality disciplines.