3DIC Advance Package Design Engineer

3DIC Advanced Packaging Design Engineer Salary: Competitive and based on experience Location: Hsinchu Keywords: collaborative, supportive leadership, knowledgeable, dependable, inclusive, flexible working opportunities, training opportunities, generous pensions contributions

3DIC Advanced Packaging Design Engineer

Salary: Competitive and based on experience

Location: Hsinchu

Keywords: collaborative, supportive leadership, knowledgeable, dependable, inclusive, flexible working opportunities, training opportunities, generous pensions contributions

A leading technology innovator in Hsinchu is seeking a 3DIC Advanced Package Design Engineer to join their highly skilled team. This role offers you the opportunity to contribute to cutting-edge advancements in semiconductor packaging, focusing on both 2.5D and 3D IC technologies. You will be at the forefront of developing and enhancing design methodologies, supporting the creation of new flows for quality assurance, and collaborating with talented engineers across multiple disciplines. The organisation is renowned for its commitment to fostering an inclusive environment, providing flexible working opportunities, and investing in your professional growth through comprehensive training programmes. If you are passionate about advanced package design and eager to work within a supportive network that values knowledge sharing and teamwork, this position will empower you to make a significant impact while enjoying generous benefits and ongoing development.

• You will play a pivotal role in shaping the future of advanced package design by contributing to the development and enhancement of methodologies for 2.5D and 3D IC technologies, ensuring that your expertise directly influences product innovation and feasibility.
• The organisation is committed to creating an inclusive workplace where flexible working opportunities, generous pension contributions, and continuous training are prioritised, allowing you to thrive both professionally and personally.
• As part of a knowledgeable and dependable team, you will have the chance to collaborate with industry experts, engage in customer-facing activities, and support the roadmap for advanced package design tools, all within a supportive leadership structure that encourages growth and learning.

What you'll do:

As a 3DIC Advanced Package Design Engineer based in Hsinchu, your day-to-day responsibilities will revolve around driving innovation in semiconductor packaging. You will be deeply involved in developing methodologies that underpin both 2.5D and 3D IC technologies while leading efforts to establish new flows for quality assurance across physical, electrical, and thermal domains. Your role will require close collaboration with cross-functional teams including layout engineers, tool developers, vendors, and customers. By leveraging your programming skills in EDA tools such as TCL, PERL or SKILL, and Python, you will streamline workflows and support the integration of advanced solutions into the product roadmap. Representing the package design team during customer interactions will allow you to share your expertise while building strong partnerships. Success in this role hinges on your ability to coordinate complex projects efficiently, communicate effectively with stakeholders at all levels, and contribute meaningfully to both technical development and organisational goals.

• Contribute actively to the development and enhancement of design methodologies for 2.5D and 3D IC advanced package design, ensuring best practices are implemented throughout the process.
• Lead the creation of new design and signoff flows focused on physical, electrical, and thermal quality assurance, guaranteeing robust performance standards.
• Support package design teams by defining a comprehensive tool roadmap for advanced package design, facilitating seamless integration of innovative solutions.
• Participate in interposer designs as well as advanced package designs and test vehicles, aligning these efforts with the overall product design roadmap and feasibility studies.
• Represent the package design team during customer engagements for advanced package designs, providing expert guidance and fostering collaborative relationships.
• Collaborate closely with layout engineers for substrate design and layout using Cadence APD, ensuring accuracy and efficiency in project execution.
• Utilise EDA tools programming skills such as TCL, PERL or SKILL, and Python programming to automate processes and enhance workflow productivity.
• Engage with assembly, foundry, and substrate vendors to ensure smooth coordination across all stages of package development.
• Contribute to 3DIC PDK development and enablement initiatives as required by project demands.
• Maintain excellent communication and presentation skills for executive project coordination, ensuring clarity across all stakeholders.