Senior Director, Semiconductor Packaging Development

Join a leading global semiconductor company to lead worldwide packaging technology development and engineering. This executive role is responsible for defining packaging strategy, driving technology innovation, leading global engineering teams, and partnering with R&D, manufacturing, and supply chain organizations to deliver next-generation semiconductor products.

Keywords: collaborative, global teams, semiconductor packaging, cross-functional, integration, reliability, supportive leadership, knowledgeable, dependable, inclusive

A leading global semiconductor organisation is seeking a Senior Director of Packaging Technology Development and Engineering to guide international teams in the creation and integration of advanced packaging solutions for high-performance products. This pivotal role offers you the opportunity to shape package architectures, assembly processes, and reliability standards while working closely with design, manufacturing, suppliers, and quality teams. You will be at the forefront of technological advancement, driving innovation from concept through qualification and into high-volume production. The organisation values flexibility, knowledge sharing, and supportive leadership, providing an environment where your expertise can flourish alongside a network of talented professionals. If you are passionate about collaborative problem-solving and eager to make a lasting impact on the future of semiconductor packaging, this is your chance to join a team that prioritises growth, inclusivity, and technical excellence.

• You will lead global teams in developing cutting-edge packaging solutions for high-performance semiconductor products, ensuring seamless integration across multiple disciplines.
• The organisation offers flexible working opportunities and encourages knowledge sharing within a supportive leadership structure that values dependability and inclusivity.
• Your deep expertise will be instrumental in shaping package architectures, assembly processes, and reliability standards while collaborating with cross-functional partners worldwide.

What you'll do:

As Senior Director of Packaging Technology Development and Engineering you will play a central role in guiding global teams through the entire lifecycle of semiconductor packaging—from conceptualisation to qualification and mass production. Your day-to-day responsibilities will involve overseeing the development of innovative packaging solutions tailored for analog and power products. You will collaborate extensively with cross-functional partners including IC design experts, substrate specialists, board engineers, thermal analysts, reliability professionals, manufacturing teams as well as external suppliers. By defining package architectures that meet stringent electrical, thermal, mechanical and cost requirements you will ensure each solution is optimised for both performance and manufacturability. Your expertise will be crucial in supervising layout reviews; performing detailed simulations; developing efficient assembly flows; leading rigorous qualification activities; resolving complex issues during prototype builds; maintaining thorough documentation; and contributing to strategic roadmaps that drive organisational growth. Success in this role requires not only technical mastery but also a commitment to collaborative teamwork—ensuring every project benefits from shared knowledge and inclusive decision-making.

• Guide international teams in designing, developing, and qualifying semiconductor packaging solutions for analog and power products from initial concept through to high-volume production.
• Oversee the implementation of advanced packaging technologies such as flip-chip, chip embedding, wafer-level packaging (WLP/FOWLP), panel-level packaging, system-in-package (SiP), multi-chip modules (MCM), power modules, and leaded packages for power applications.
• Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements to ensure optimal performance and manufacturability.
• Drive technology selection and development for new product introductions by collaborating with IC design, substrate, board, thermal, reliability, and manufacturing teams.
• Supervise package layout reviews including stack-up definition, material selection, interconnect strategy, and ensure compatibility across all relevant platforms.
• Perform simulations and analyses related to thermal, mechanical, electrical properties as well as design for manufacturability (DFM) to support robust package development.
• Develop assembly flows and process requirements for captive plants as well as OSATs/manufacturing partners to optimise production efficiency.
• Lead package qualification activities including DOE planning, failure analysis, reliability testing to guarantee product integrity throughout its lifecycle.
• Resolve packaging-related issues during NPI prototype builds, qualification phases, and production ramp by collaborating with suppliers and internal/external manufacturing partners.
• Create and maintain comprehensive package specifications, design rules, process documentation, technical reports while partnering with corporate leadership to define multi-year capability/capacity roadmaps aligned with organisational strategy.

What you bring:

To thrive as Senior Director of Packaging Technology Development and Engineering you will bring extensive experience gained over more than fifteen years within the semiconductor or advanced electronics packaging sector. Your academic background—ideally at MSc or PhD level—will underpin your technical proficiency across electrical engineering or related fields. You have successfully managed global teams for over a decade demonstrating supportive leadership qualities that encourage collaboration among colleagues from varied backgrounds. Your comprehensive understanding of packaging technologies spans materials science through assembly processes enabling you to develop solutions that meet demanding performance criteria. Familiarity with industry standards governing reliability testing ensures every product achieves consistent quality benchmarks while your insight into chip-package interactions supports optimal design outcomes. Experience engaging with OSATs substrate vendors assembly houses supply chain partners allows you to drive process improvements efficiently. Your troubleshooting acumen enables swift resolution of complex issues safeguarding product integrity throughout its lifecycle. Project management expertise combined with strong interpersonal communication skills ensures you can connect effectively across functions fostering an inclusive environment where knowledge sharing is paramount.

• MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering or related field is required for this position.
• At least 15 years of direct experience in semiconductor packaging or advanced electronics packaging is essential to excel in this role.
• A minimum of 10 years managing global teams with proven leadership skills is necessary for effective collaboration across international boundaries.
• Comprehensive knowledge of packaging technologies including materials science and assembly processes is vital for successful solution development.
• Experience conducting package reliability testing along with familiarity with industry qualification standards ensures robust product performance.
• Deep understanding of thermal, mechanical and electrical interactions within package design—including chip-package interaction (CPI)—is highly valued.
• Demonstrated ability working with OSATs (Outsourced Semiconductor Assembly & Test), substrate vendors, assembly houses as well as supply chain partners is important for process optimisation.
• Proven troubleshooting skills addressing packaging failures coupled with root cause analysis capabilities are critical for maintaining product integrity.
• Strong project management abilities combined with excellent cross-functional communication skills foster effective teamwork among diverse groups.

What sets this company apart:

This organisation stands out as a global leader in the semiconductor industry renowned for its commitment to technical excellence collaborative teamwork and continuous professional development. Employees benefit from flexible working opportunities generous training programmes designed to enhance their skills as well as access to knowledgeable mentors who support career progression. The company fosters an inclusive culture where every voice is valued encouraging open communication mutual respect and shared success. Supportive leadership ensures that individuals feel empowered to contribute their ideas while dependable networks provide guidance throughout challenging projects. With a focus on growth leadership employees are given opportunities to expand their expertise take on new responsibilities and participate in shaping the future direction of the business. The organisation’s dedication to nurturing talent makes it an ideal environment for those seeking long-term career satisfaction within a dynamic yet considerate workplace.

What's next:

If you are ready to make a meaningful impact on the future of semiconductor packaging technology apply now to join this collaborative global team!

Apply today by clicking on the link provided.