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Senior High Speed Digital Design Engineer

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Seek Senior Digital Design Specialist for HPC connectivity. Lead architecture and integration of advanced chiplet IPs for AI accelerators. Join an elite global team working on cutting-edge silicon technology!

Core Responsibilities

  • IP Architecture & Development: Drive the design and micro-architecture development of high-speed interconnect and data-path digital IPs tailored for advanced modular SoC architectures.

  • Subsystem Integration: Manage the seamless integration of protocol controllers and high-speed physical layers (PHY), ensuring strict adherence to timing closure, synthesis, and Design-for-Test (DFT) requirements.

  • Specification & Implementation: Define robust architectural interface specifications, establish comprehensive verification plans, and provide technical support through physical implementation and silicon onboarding phases.

  • Cross-Functional Collaboration: Partner closely with Analog/Mixed-Signal designers, Firmware architecture teams, and system validation engineers to optimize overall silicon performance.

Contract Type: Perm

Specialism: Semiconductor

Focus: Digital Design

Industry: Engineering

Salary: Negotiable

Workplace Type: On-site

Experience Level: Associate

Location: Hsinchu City

Job Reference: S8DSL2-CBDF7C4B

Date posted: 17 June 2026

Consultant: Celine Chu