en

Services

Taiwan's leading employers trust us to deliver talent solutions tailored to their exact requirements.

Browse our range of services
Jobs

Our industry specialists will listen to your aspirations and share your story with the most prestigious organisations in Taiwan. Together, let’s write the next chapter of your career.

See all jobs
Candidates

Together, we’ll map out career-defining, life-changing pathways to achieve your career ambitions. Browse our range of services, advice, and resources.

Learn more
Services

Taiwan's leading employers trust us to deliver talent solutions tailored to their exact requirements.

Browse our range of services
Insights

Whether you’re seeking to hire talent or seeking a new career move for yourself, we have the latest facts, trends and inspiration you need.

See all resources
About Robert Walters Taiwan

For Robert Walters Taiwan, recruitment is more than just a job. We understand that behind every opportunity is the chance to make a difference to people’s lives

Learn more

Work for us

Our people are the difference. Hear stories from our people to learn more about a career at Robert Walters Taiwan.

Learn more

Vice President of Manufacturing Engineering

Save job

As VP of Manufacturing Engineering, you will bridge chip design and volume production. Reporting to the SVP of Engineering, you will lead advanced packaging, test engineering, and NPI. This executive role is responsible for ensuring product excellence, optimizing yields,

Executive Mission

The Vice President of Manufacturing Engineering owns the entire technical lifecycle of a product once it transitions from design to physical silicon. Your primary mission is to transform complex designs into high-yield, reliable products by overseeing advanced packaging, test engineering, and reliability assurance. You act as the bridge between development and mass production, ensuring every chip meets the rigorous standards required for high-volume market release.

Core Responsibilities

You will define the overarching engineering strategy for manufacturing excellence, setting critical benchmarks for yield, cost, and time-to-market. On the technical side, you take ownership of package architecture—including advanced 2.5D/3D and SiP technologies—and drive the backend processes through external partners. You are also responsible for the end-to-end product engineering journey, from first silicon characterization to implementing robust test strategies that optimize throughput and quality.

Beyond internal leadership, you serve as the executive-level interface for global foundries and OSATs. You will lead technical reviews and audits, managing the relationships that ensure production stability. During the New Product Introduction (NPI) phase, you are the final escalation point, navigating risks and cross-functional dependencies to guarantee on-time qualification and successful volume ramps for ASIC and SoC programs.

Requirements & Profile

This role requires over 15 years of semiconductor experience, with a significant portion in Director or VP-level leadership within fabless or ASIC firms. You must possess deep technical expertise in packaging, test optimization, and failure analysis. We are looking for a results-driven executive who can balance engineering rigor with business speed, someone comfortable influencing stakeholders across design, supply chain, and global manufacturing sites.

Contract Type: Perm

Specialism: Semiconductor

Focus: C-Level Executives/Senior Leaderships

Industry: Engineering

Salary: Negotiable

Workplace Type: On-site

Experience Level: Executive

Location: Taipei

Job Reference: WM1W7C-8FF0ED0D

Date posted: 23 March 2026

Consultant: Celine Chu