Vice President of Manufacturing Engineering
As VP of Manufacturing Engineering, you will bridge chip design and volume production. Reporting to the SVP of Engineering, you will lead advanced packaging, test engineering, and NPI. This executive role is responsible for ensuring product excellence, optimizing yields,
Executive Mission
The Vice President of Manufacturing Engineering owns the entire technical lifecycle of a product once it transitions from design to physical silicon. Your primary mission is to transform complex designs into high-yield, reliable products by overseeing advanced packaging, test engineering, and reliability assurance. You act as the bridge between development and mass production, ensuring every chip meets the rigorous standards required for high-volume market release.
Core Responsibilities
You will define the overarching engineering strategy for manufacturing excellence, setting critical benchmarks for yield, cost, and time-to-market. On the technical side, you take ownership of package architecture—including advanced 2.5D/3D and SiP technologies—and drive the backend processes through external partners. You are also responsible for the end-to-end product engineering journey, from first silicon characterization to implementing robust test strategies that optimize throughput and quality.
Beyond internal leadership, you serve as the executive-level interface for global foundries and OSATs. You will lead technical reviews and audits, managing the relationships that ensure production stability. During the New Product Introduction (NPI) phase, you are the final escalation point, navigating risks and cross-functional dependencies to guarantee on-time qualification and successful volume ramps for ASIC and SoC programs.
Requirements & Profile
This role requires over 15 years of semiconductor experience, with a significant portion in Director or VP-level leadership within fabless or ASIC firms. You must possess deep technical expertise in packaging, test optimization, and failure analysis. We are looking for a results-driven executive who can balance engineering rigor with business speed, someone comfortable influencing stakeholders across design, supply chain, and global manufacturing sites.
About the job
Contract Type: Perm
Specialism: Semiconductor
Focus: C-Level Executives/Senior Leaderships
Industry: Engineering
Salary: Negotiable
Workplace Type: On-site
Experience Level: Executive
Location: Taipei
FULL_TIMEJob Reference: WM1W7C-8FF0ED0D
Date posted: 23 March 2026
Consultant: Celine Chu
taipei semiconductor/vp-director-bu-head 2026-03-23 2026-05-22 engineering Taipei TW Robert Walters https://www.robertwalters.com.tw https://www.robertwalters.com.tw/content/dam/robert-walters/global/images/logos/web-logos/square-logo.png true