Mechanical Engineer (Liquid Cooling)

A leading global technology solutions provider is seeking a Mechanical Engineer to join their R&D/Product Development Engineering Team in Taipei. This role offers the unique opportunity to drive the development of next-generation liquid cooling solutions for AI servers, data centres, and high-power electronics applications. You will be at the forefront of innovation, guiding advanced cold plate technologies and coolant flow architectures from concept through to mass production. The organisation is renowned for its commitment to nurturing talent, offering flexible working arrangements including partial remote work and training at their Tamsui facility. With a strong emphasis on teamwork, humility, and eagerness to learn, this position is perfect for those who thrive in a supportive environment that values growth and collaboration. If you are passionate about mechanical engineering and want to make a tangible impact on future technologies, this is your chance to join a team that transforms ideas into life-changing products.

• Lead the development of next-generation liquid cooling products and thermal management solutions tailored for high-performance computing environments such as AI servers and data centres.
• Define product architecture, design concepts, and technology roadmaps for future liquid cooling platforms by collaborating closely with cross-functional teams.
• Evaluate emerging cooling technologies and drive innovation initiatives aimed at improving thermal performance, reliability, and cost competitiveness across multiple applications.
• Design and develop advanced cold plates featuring high-performance internal structures and thermal enhancement features to meet increasing heat flux requirements.
• Develop innovative cold plate architectures that support next-generation processor platforms while optimising manufacturability and system integration.
• Collaborate with thermal engineers to optimise thermal resistance, pressure drop, manufacturability, and system integration using simulation tools and experimental validation.
• Create innovative coolant flow path designs and manifold architectures that improve cooling efficiency and flow distribution within complex electronic systems.
• Apply CFD analysis methodologies to optimise internal channel structures, flow balancing strategies, and pressure drop performance for superior thermal-fluid outcomes.
• Lead the development and qualification of new cold plate joining technologies such as vacuum brazing, laser welding, friction stir welding, diffusion bonding, ensuring process capability and scalability.
• Drive end-to-end product development activities from concept through prototype creation, design validation, qualification testing, mass production readiness, including DFM/DFA optimisation.