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Technology Head (Architecture)

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Our client is in search of a highly motivated and dynamic individual to fill the position of Technology Head (Architecture). This role calls for an individual with excellent interpersonal and communication skills, a strong focus on product promotion, and customer engagement. Proficiency in both English and Japanese will be a significant advantage as this role involves frequent business travel to the United Kingdom, the United States, and European countries.

TECHNOLOGY HEAD (ARCHITECTURE)

Salary: Competitive and based on experience
Location: Hsinchu
Keywords: Technology, Head, Architecture, Hsinchu

* Highly motivated and dynamic individual
* Excellent interpersonal and communication skills
* Frequent business travel

What you'll do:
As the Technology Head (Architecture), your primary responsibility will be to develop the overall technology strategy. You will use your excellent interpersonal and communication skills to promote products effectively and engage customers. Your role will involve frequent business travel to the UK, US, and Europe. Collaboration is key in this role as you work with team members to achieve company goals. Reporting directly to the General Manager or Chairman of the company, you will initially handle Individual Contributor responsibilities with potential discussions for managerial responsibilities based on suitability and performance.


* Develop overall technology strategy
* Promote products effectively to engage customers
* Travel frequently for business to the UK, US, and Europe
* Collaborate with team members to achieve company goals
* Report directly to the General Manager or Chairman of the company
* Initially handle Individual Contributor responsibilities with potential for managerial roles based on performance


What you bring:
The ideal candidate for the Technology Head (Architecture) role brings a strong charm in both personal and professional aspects, emphasizing expertise in product promotion and effective customer interaction. A Ph.D. graduate from a renowned university in Europe or the US is preferred but exceptional candidates with domestic doctoral degrees will also be considered. A background in Electrical Engineering (EE) is essential, along with a solid understanding of System-on-Chip (SOC) concepts. Proficiency in software solutions for SOC, addressing performance issues, data structure planning, and architectural design is required. Familiarity with SystemC and Virtual Platform for hardware simulation through software methods is a plus. The candidate should have a keen interest in the future development of AI. This includes exploring ideas and concepts for intelligently identifying performance issues and designing architectures using AI methodologies. The ability to work effectively within a team is crucial for success in this role.


* Strong charm in both personal and professional aspects
* Expertise in product promotion and effective customer interaction
* Ph.D. graduate from a renowned university in Europe or the US preferred
* Background in Electrical Engineering (EE) essential
* Solid understanding of System-on-Chip (SOC) concepts required
* Proficiency in software solutions for SOC necessary
* Keen interest in future development of AI desirable
* Ability to work effectively within a team crucial


What sets this company apart:
Our client is a listed company that provides IP selling and IC design services. They are known for their commitment to innovation and excellence, offering a dynamic and supportive work environment where employees are encouraged to grow and succeed. They value collaboration and team effort, making it an ideal place for individuals who thrive in such settings.

What's next:
Ready to take the next step in your career? Apply today!
Please share your resume by clicking on the link below.

Contract Type: FULL_TIME

Specialism: Semiconductor

Focus: VP, Director & BU Head

Industry: Engineering

Salary: Negotiable

Workplace Type: On-site

Experience Level: Executive

Location: Hsinchu City

Job Reference: K125MX-6BE12DA1

Date posted: 26 August 2024

Consultant: Gary Liao

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