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Principal Package Engineer (CPO)

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About the role A technology company is seeking a Principal Package Assembly Engineer to lead advanced package development and assembly processes. You will work closely with internal teams and external partners to develop scalable, high-reliability solutions for next-generation semiconductor products.

About the role

A semiconductor technology company is seeking a Principal Package Assembly Engineer to drive advanced packaging development. You will lead assembly process design and work closely with internal teams and external partners to deliver high-performance and scalable solutions for next-generation products.


What you’ll do

  • Develop end-to-end package assembly and test processes for advanced packaging (2D/3D, heterogeneous integration)
  • Define package architecture with DFT / DFM / DFR considerations
  • Collaborate with OSATs and vendors to drive process development, yield improvement, and manufacturability
  • Design and manage test vehicles to support validation and process optimization
  • Plan and execute DOE, analyze results, and improve process performance
  • Identify reliability risks (thermal/mechanical) and implement effective solutions
  • Support product transition from development to mass production
  • Work on emerging technologies such as co-packaged optics (CPO) and high-speed integration (plus)

What you bring

  • 10+ years of experience in semiconductor packaging / assembly / process development
  • Strong experience working with OSATs
  • Hands-on experience in 2D/3D packaging or heterogeneous integration
  • Familiarity with emerging packaging trends (e.g., Photonics experience is a must)
  • Experience in test vehicle design, DOE, and validation
  • Knowledge of thermo-mechanical and reliability challenges
  • Strong problem-solving and cross-team communication skills

What’s on offer

  • Opportunity to work on advanced packaging and next-generation integration technologies
  • Collaborative and fast-paced engineering environment
  • Flexible working model
  • Competitive compensation and benefits

Contract Type: Perm

Specialism: Semiconductor

Focus: Package/Test

Industry: Engineering

Salary: Negotiable

Workplace Type: Hybrid

Experience Level: Associate

Location: Hsinchu City

Job Reference: 1ARY4I-C5B78DE9

Date posted: 2 April 2026

Consultant: Joanne Chen