Principal Package Engineer (CPO)
About the role A technology company is seeking a Principal Package Assembly Engineer to lead advanced package development and assembly processes. You will work closely with internal teams and external partners to develop scalable, high-reliability solutions for next-generation semiconductor products.
About the role
A semiconductor technology company is seeking a Principal Package Assembly Engineer to drive advanced packaging development. You will lead assembly process design and work closely with internal teams and external partners to deliver high-performance and scalable solutions for next-generation products.
What you’ll do
- Develop end-to-end package assembly and test processes for advanced packaging (2D/3D, heterogeneous integration)
- Define package architecture with DFT / DFM / DFR considerations
- Collaborate with OSATs and vendors to drive process development, yield improvement, and manufacturability
- Design and manage test vehicles to support validation and process optimization
- Plan and execute DOE, analyze results, and improve process performance
- Identify reliability risks (thermal/mechanical) and implement effective solutions
- Support product transition from development to mass production
- Work on emerging technologies such as co-packaged optics (CPO) and high-speed integration (plus)
What you bring
- 10+ years of experience in semiconductor packaging / assembly / process development
- Strong experience working with OSATs
- Hands-on experience in 2D/3D packaging or heterogeneous integration
- Familiarity with emerging packaging trends (e.g., Photonics experience is a must)
- Experience in test vehicle design, DOE, and validation
- Knowledge of thermo-mechanical and reliability challenges
- Strong problem-solving and cross-team communication skills
What’s on offer
- Opportunity to work on advanced packaging and next-generation integration technologies
- Collaborative and fast-paced engineering environment
- Flexible working model
- Competitive compensation and benefits
About the job
Contract Type: Perm
Specialism: Semiconductor
Focus: Package/Test
Industry: Engineering
Salary: Negotiable
Workplace Type: Hybrid
Experience Level: Associate
Location: Hsinchu City
FULL_TIMEJob Reference: 1ARY4I-C5B78DE9
Date posted: 2 April 2026
Consultant: Joanne Chen
taipei semiconductor/package-test 2026-04-02 2026-06-01 engineering Hsinchu City TW Robert Walters https://www.robertwalters.com.tw https://www.robertwalters.com.tw/content/dam/robert-walters/global/images/logos/web-logos/square-logo.png true