Packaging Engineer (FPGA)

About the Role We are looking for an experienced Principal Packaging Engineer to lead advanced semiconductor packaging development for high-performance IC products. This role involves cross-functional collaboration, technical leadership, and hands-on problem solving in package design, assembly process optimization, and technology development. You will work closely with silicon, packaging, systems, and IC design teams to deliver reliable, manufacturable, and cost-effective package solutions for next-generation devices. This position suits engineers who enjoy both technical depth and teamwork in a supportive environment.

Key Responsibilities

• Lead the definition and development of advanced IC package solutions, ensuring electrical, mechanical, and thermal requirements are met.

• Collaborate with silicon and IC design teams to evaluate and select optimal package structures aligned with performance, cost, and reliability targets.

• Develop BOMs, define assembly processes, and support troubleshooting for package-related issues in NPI or technology introduction.

• Prepare detailed documentation, design guidelines, and assembly instructions for internal and external stakeholders.

• Drive new package technology development and continuous improvement projects.

• Oversee package qualification for commercial and automotive applications.

• Coordinate with assembly partners from early development through volume production.

• Stay updated on packaging trends and propose innovations to enhance reliability and manufacturability.

• Support process enhancement initiatives and identify opportunities for structural or material improvements.

What You Bring

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.

• 10+ years of experience in semiconductor packaging, with at least 5 years focused on IC package development.

• Strong knowledge of mid-range pin-count packages such as flip chip BGA/LGA (organic/ceramic), WLCSP, wire-bond BGA, or CSP.

• Understanding of chip-package interaction, material behavior, and reliability mechanisms.

• Experience with BEOL-related topics such as top metal, passivation, UBM, bumping, or wafer-level processes.

• Familiarity with substrate technologies and manufacturing processes.

• Proven ability to collaborate across functions and drive alignment among engineering teams.

• Demonstrated experience managing multiple projects from concept to production.

• Strong analytical and problem-solving abilities, with high attention to detail.

What You Can Expect

• A collaborative and knowledge-sharing work environment.

• Opportunities to participate in advanced technology development and long-term product roadmap initiatives.

• Flexible working arrangements and ongoing professional development opportunities.

• A culture that values teamwork, open communication, and technical excellence.