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(Confidential) Application Engineering Director-Data Center

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A technology leader in data center connectivity is seeking an Applications Engineering Director to lead its Optical Hardware Systems Applications team in Hsinchu. This role will oversee technical customer engagement, team development, and cross-functional execution for high-speed optical transceiver solutions serving global data center markets. You will be responsible for building a strong applications engineering organisation, driving customer success, and contributing to product strategy across next-generation 400G/800G/1.6T connectivity platforms.

Key Responsibilities

Team Leadership & Strategy

  • Lead and develop a team of Optical Hardware Systems Applications Engineers

  • Define annual objectives, resource planning, and operating budgets

  • Establish structured training programmes for internal teams and global partners

  • Represent the company at major industry exhibitions

Customer & Business Engagement

  • Serve as executive technical interface for tier-1 data center customers

  • Support design-in, system validation, debugging, and commissioning activities

  • Partner with Sales and regional FAE teams to secure design wins

  • Deliver technical presentations, seminars, and executive-level discussions

Product & Technical Execution

  • Support optical transceiver development from concept to volume production

  • Collaborate with engineering teams to resolve system-level issues and drive root-cause analysis

  • Contribute to product roadmap planning through market intelligence and competitive analysis

  • Oversee lab operations, EVK readiness, vendor coordination, and validation workflows


Requirements

  • 10+ years of experience in applications engineering leadership within optical hardware or data center connectivity

  • Bachelor’s degree required; Master’s or PhD in EE/CE preferred

  • Strong background in optical transceiver development (400G / 800G / 1.6T)

  • Proficiency in C/C++ and experience with firmware/software integration

  • Experience with RF/SI simulation tools (ADS, HFSS)

  • Experience developing or supporting ATE systems (Python preferred)

  • Strong knowledge of high-speed digital, RF, and microwave PCB design

  • Hands-on familiarity with lab instruments (BER tester, DCA, spectrum/network analyzer)

  • Excellent English communication skills and ability to interface with global customers


Why Join

  • Lead a high-impact team supporting next-generation data center infrastructure

  • Influence product roadmap and strategic customer engagement

  • Exposure to global tier-1 customers and industry events

  • Flexible working arrangements and long-term organisational growth

  • High technical ownership in a rapidly evolving connectivity market

Contract Type: Perm

Specialism: Semiconductor

Focus: AE, FAE & Technical Support

Industry: Engineering

Salary: Negotiable

Workplace Type: On-site

Experience Level: Director

Location: Hsinchu City

Job Reference: WENSO2-4EEB3209

Date posted: 3 March 2026

Consultant: Joanne Chen